4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

Property	Value
dcterms:bibliographicCitation	<http://dblp.uni-trier.de/rec/bibtex/conf/vlsit/LuCHLCLCLC23>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/C.-H._Chuang>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/C.-H._Huang>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/C.-L._Lu>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/M.-H._Chiu>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Ming_Han_Liao>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/S.-C._Lin>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/S.-Z._Chang>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/W.-Y._Lai>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Y.-H._Chang>
foaf:homepage	<http://dx.doi.org/doi.org%2F10.23919%2FVLSITechnologyandCir57934.2023.10185308>
foaf:homepage	<https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185308>
dc:identifier	DBLP conf/vlsit/LuCHLCLCLC23 (xsd:string)
dc:identifier	DOI doi.org%2F10.23919%2FVLSITechnologyandCir57934.2023.10185308 (xsd:string)
dcterms:issued	2023 (xsd:gYear)
rdfs:label	4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration. (xsd:string)
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/C.-H._Chuang>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/C.-H._Huang>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/C.-L._Lu>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/M.-H._Chiu>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Ming_Han_Liao>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/S.-C._Lin>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/S.-Z._Chang>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/W.-Y._Lai>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Y.-H._Chang>
swrc:pages	1-2 (xsd:string)
dcterms:partOf	<https://dblp.l3s.de/d2r/resource/publications/conf/vlsit/2023>
owl:sameAs	<http://bibsonomy.org/uri/bibtexkey/conf/vlsit/LuCHLCLCLC23/dblp>
owl:sameAs	<http://dblp.rkbexplorer.com/id/conf/vlsit/LuCHLCLCLC23>
rdfs:seeAlso	<http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#LuCHLCLCLC23>
rdfs:seeAlso	<https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185308>
swrc:series	<https://dblp.l3s.de/d2r/resource/conferences/vlsit>
dc:title	4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration. (xsd:string)
dc:type	<http://purl.org/dc/dcmitype/Text>
rdf:type	swrc:InProceedings
rdf:type	foaf:Document