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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsit/VenkatesanLGPMM22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aaron_Voon-Yew_Thean>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Baochang_Xu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Brian_Pile>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Daniel_Meerovich>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/James_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinyu_Mo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lucas_Soldano>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Simon_Chun_Kiat_Goh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Suresh_Venkatesan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yang_Jing>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yeow_Kheng_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu_Zhang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FVLSITechnologyandCir46769.2022.9830432>
foaf:homepage <https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830432>
dc:identifier DBLP conf/vlsit/VenkatesanLGPMM22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FVLSITechnologyandCir46769.2022.9830432 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aaron_Voon-Yew_Thean>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Baochang_Xu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Brian_Pile>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Daniel_Meerovich>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/James_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinyu_Mo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lucas_Soldano>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Simon_Chun_Kiat_Goh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Suresh_Venkatesan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yang_Jing>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yeow_Kheng_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu_Zhang>
swrc:pages 381-382 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vlsit/2022>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vlsit/VenkatesanLGPMM22/dblp>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsit/vlsit2022.html#VenkatesanLGPMM22>
rdfs:seeAlso <https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830432>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsit>
dc:title A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document