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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vts/KovalF96>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dmytro_V._Fedasyuk>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vladimir_A._Koval>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FVTEST.1996.510867>
foaf:homepage <https://doi.org/10.1109/VTEST.1996.510867>
dc:identifier DBLP conf/vts/KovalF96 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FVTEST.1996.510867 (xsd:string)
dcterms:issued 1996 (xsd:gYear)
rdfs:label The MCM's thermal testing. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dmytro_V._Fedasyuk>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vladimir_A._Koval>
swrc:pages 266-271 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vts/1996>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vts/KovalF96/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/vts/KovalF96>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vts/vts1996.html#KovalF96>
rdfs:seeAlso <https://doi.org/10.1109/VTEST.1996.510867>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vts>
dc:subject multichip modules; integrated circuit testing; integrated circuit modelling; heat transfer; MCM; simulation; testing; thermal field; structure decomposition; heat exchange; model; multilevel rectangular parallelepiped; MONSTR-M system; design (xsd:string)
dc:title The MCM's thermal testing. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document