Thermal Modeling of Heat Transfer within Copper Heated Roller of Laminated Object Manufacturing Apparatus: Accumulated Heat, 2D Axisymmetric Transient and Stationary Heat Conduction Models. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

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dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Bakary_S._Doumbia>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Chunmei_Yang>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Wenji_Yu>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Yan_Ma>
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dc:identifier	DBLP data/10/DoumbiaYMY21 (xsd:string)
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dcterms:issued	2021 (xsd:gYear)
rdfs:label	Thermal Modeling of Heat Transfer within Copper Heated Roller of Laminated Object Manufacturing Apparatus: Accumulated Heat, 2D Axisymmetric Transient and Stationary Heat Conduction Models. (xsd:string)
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foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Wenji_Yu>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Yan_Ma>
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dc:publisher	IEEE DataPort (xsd:string)
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dc:title	Thermal Modeling of Heat Transfer within Copper Heated Roller of Laminated Object Manufacturing Apparatus: Accumulated Heat, 2D Axisymmetric Transient and Stationary Heat Conduction Models. (xsd:string)
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