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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/access/HuangROP20>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Anto_Raj>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chien-Ming_Huang_0004>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_D._Osterman>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_G._Pecht>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FACCESS.2020.3010771>
foaf:homepage <https://doi.org/10.1109/ACCESS.2020.3010771>
dc:identifier DBLP journals/access/HuangROP20 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FACCESS.2020.3010771 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/access>
rdfs:label Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Anto_Raj>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chien-Ming_Huang_0004>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_D._Osterman>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_G._Pecht>
swrc:pages 134194-134208 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/access/HuangROP20/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/access/HuangROP20>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/access/access8.html#HuangROP20>
rdfs:seeAlso <https://doi.org/10.1109/ACCESS.2020.3010771>
dc:title Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 8 (xsd:string)