Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/access/LaaksoBLMAFSEN18
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/access/LaaksoBLMAFSEN18
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Andreas_C._Fischer
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Frank_Niklaus
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/G%E2%88%9A%E2%88%82ran_Stemme
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Gustaf_E._Martensson
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jessica_Liljeholm
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Mikhail_Asiatici
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Miku_J._Laakso
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Simon_J._Bleiker
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Thorbjorn_Ebefors
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FACCESS.2018.2861886
>
foaf:
homepage
<
https://doi.org/10.1109/ACCESS.2018.2861886
>
dc:
identifier
DBLP journals/access/LaaksoBLMAFSEN18
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FACCESS.2018.2861886
(xsd:string)
dcterms:
issued
2018
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/access
>
rdfs:
label
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Andreas_C._Fischer
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Frank_Niklaus
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/G%E2%88%9A%E2%88%82ran_Stemme
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Gustaf_E._Martensson
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jessica_Liljeholm
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Mikhail_Asiatici
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Miku_J._Laakso
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Simon_J._Bleiker
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Thorbjorn_Ebefors
>
swrc:
pages
44306-44317
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/access/LaaksoBLMAFSEN18/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/access/LaaksoBLMAFSEN18
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/access/access6.html#LaaksoBLMAFSEN18
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ACCESS.2018.2861886
>
dc:
title
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
6
(xsd:string)