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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/access/TsaiCCC16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cheng-Chung_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinn-Tsong_Tsai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jyh-Horng_Chou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wen-Ping_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FACCESS.2016.2581258>
foaf:homepage <https://doi.org/10.1109/ACCESS.2016.2581258>
dc:identifier DBLP journals/access/TsaiCCC16 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FACCESS.2016.2581258 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/access>
rdfs:label Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cheng-Chung_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinn-Tsong_Tsai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jyh-Horng_Chou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wen-Ping_Chen>
swrc:pages 3034-3045 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/access/TsaiCCC16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/access/TsaiCCC16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/access/access4.html#TsaiCCC16>
rdfs:seeAlso <https://doi.org/10.1109/ACCESS.2016.2581258>
dc:title Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 4 (xsd:string)