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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/asc/Tsai12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tsung-Nan_Tsai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.asoc.2012.03.066>
foaf:homepage <https://doi.org/10.1016/j.asoc.2012.03.066>
dc:identifier DBLP journals/asc/Tsai12 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.asoc.2012.03.066 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/asc>
rdfs:label Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tsung-Nan_Tsai>
swrc:number 8 (xsd:string)
swrc:pages 2601-2613 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/asc/Tsai12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/asc/Tsai12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/asc/asc12.html#Tsai12>
rdfs:seeAlso <https://doi.org/10.1016/j.asoc.2012.03.066>
dc:title Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 12 (xsd:string)