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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/displays/ChenK06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Ho_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhi_Gang_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.displa.2006.04.002>
foaf:homepage <https://doi.org/10.1016/j.displa.2006.04.002>
dc:identifier DBLP journals/displays/ChenK06 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.displa.2006.04.002 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/displays>
rdfs:label A new COP bonding using non-conductive adhesives for LCDs driver IC packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Ho_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhi_Gang_Chen>
swrc:number 3 (xsd:string)
swrc:pages 130-135 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/displays/ChenK06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/displays/ChenK06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/displays/displays27.html#ChenK06>
rdfs:seeAlso <https://doi.org/10.1016/j.displa.2006.04.002>
dc:title A new COP bonding using non-conductive adhesives for LCDs driver IC packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 27 (xsd:string)