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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/dt/DavisWMXHMSSF05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ambarish_M._Sule>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Christopher_Mineo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hao_Hua>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jian_Xu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/John_M._Wilson_0002>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Stephen_E._Mick>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FMDT.2005.136>
foaf:homepage <https://doi.org/10.1109/MDT.2005.136>
dc:identifier DBLP journals/dt/DavisWMXHMSSF05 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FMDT.2005.136 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/dt>
rdfs:label Demystifying 3D ICs: The Pros and Cons of Going Vertical. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ambarish_M._Sule>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Christopher_Mineo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hao_Hua>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jian_Xu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/John_M._Wilson_0002>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Stephen_E._Mick>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis>
swrc:number 6 (xsd:string)
swrc:pages 498-510 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/dt/DavisWMXHMSSF05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/dt/DavisWMXHMSSF05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/dt/dt22.html#DavisWMXHMSSF05>
rdfs:seeAlso <https://doi.org/10.1109/MDT.2005.136>
dc:subject Parallel I/O, I/O and Data Communications , Transmitters, Receivers, C.0.e System architectures, integration and modeling, Interconnection architectures, Placement and routing, Routing and layout (xsd:string)
dc:title Demystifying 3D ICs: The Pros and Cons of Going Vertical. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 22 (xsd:string)