Demystifying 3D ICs: The Pros and Cons of Going Vertical.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/dt/DavisWMXHMSSF05
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/dt/DavisWMXHMSSF05
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ambarish_M._Sule
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_Mineo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hao_Hua
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jian_Xu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/John_M._Wilson_0002
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Stephen_E._Mick
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FMDT.2005.136
>
foaf:
homepage
<
https://doi.org/10.1109/MDT.2005.136
>
dc:
identifier
DBLP journals/dt/DavisWMXHMSSF05
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FMDT.2005.136
(xsd:string)
dcterms:
issued
2005
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/dt
>
rdfs:
label
Demystifying 3D ICs: The Pros and Cons of Going Vertical.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ambarish_M._Sule
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_Mineo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hao_Hua
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jian_Xu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/John_M._Wilson_0002
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Stephen_E._Mick
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis
>
swrc:
number
6
(xsd:string)
swrc:
pages
498-510
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/dt/DavisWMXHMSSF05/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/dt/DavisWMXHMSSF05
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/dt/dt22.html#DavisWMXHMSSF05
>
rdfs:
seeAlso
<
https://doi.org/10.1109/MDT.2005.136
>
dc:
subject
Parallel I/O, I/O and Data Communications , Transmitters, Receivers, C.0.e System architectures, integration and modeling, Interconnection architectures, Placement and routing, Routing and layout
(xsd:string)
dc:
title
Demystifying 3D ICs: The Pros and Cons of Going Vertical.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
22
(xsd:string)