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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/dt/HanLJZ15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Boo_Yang_Jung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Boon_Long_Lau>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiaowu_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yong_Han>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FMDAT.2015.2440414>
foaf:homepage <https://doi.org/10.1109/MDAT.2015.2440414>
dc:identifier DBLP journals/dt/HanLJZ15 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FMDAT.2015.2440414 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/dt>
rdfs:label Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Boo_Yang_Jung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Boon_Long_Lau>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiaowu_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yong_Han>
swrc:number 4 (xsd:string)
swrc:pages 32-39 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/dt/HanLJZ15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/dt/HanLJZ15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/dt/dt32.html#HanLJZ15>
rdfs:seeAlso <https://doi.org/10.1109/MDAT.2015.2440414>
dc:title Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 32 (xsd:string)