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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/elektrik/GuibaneHBM18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Abdellatif_Mtibaa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Badi_Guibane>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Belgacem_Hamdi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Brahim_Bensalem>
foaf:homepage <http://dx.doi.org/doi.org%2F10.3906%2Felk-1711-220>
foaf:homepage <https://doi.org/10.3906/elk-1711-220>
dc:identifier DBLP journals/elektrik/GuibaneHBM18 (xsd:string)
dc:identifier DOI doi.org%2F10.3906%2Felk-1711-220 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/elektrik>
rdfs:label A novel efficient TSV built-in test for stacked 3D ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Abdellatif_Mtibaa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Badi_Guibane>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Belgacem_Hamdi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Brahim_Bensalem>
swrc:number 4 (xsd:string)
swrc:pages 1909-1921 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/elektrik/GuibaneHBM18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/elektrik/GuibaneHBM18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/elektrik/elektrik26.html#GuibaneHBM18>
rdfs:seeAlso <https://doi.org/10.3906/elk-1711-220>
dc:title A novel efficient TSV built-in test for stacked 3D ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 26 (xsd:string)