A novel efficient TSV built-in test for stacked 3D ICs.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/elektrik/GuibaneHBM18
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2018
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A novel efficient TSV built-in test for stacked 3D ICs.
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A novel efficient TSV built-in test for stacked 3D ICs.
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