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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/et/SandbornGDABP94>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ashish_Parikh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ken_Drake>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Linda_Bal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Magdy_S._Abadir>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peter_Sandborn>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rajarshi_Ghosh>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1007%2FBF00972080>
foaf:homepage <https://doi.org/10.1007/BF00972080>
dc:identifier DBLP journals/et/SandbornGDABP94 (xsd:string)
dc:identifier DOI doi.org%2F10.1007%2FBF00972080 (xsd:string)
dcterms:issued 1994 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/et>
rdfs:label Multichip systems trade-off analysis tool. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ashish_Parikh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ken_Drake>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Linda_Bal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Magdy_S._Abadir>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peter_Sandborn>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rajarshi_Ghosh>
swrc:number 2-3 (xsd:string)
swrc:pages 207-218 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/et/SandbornGDABP94/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/et/SandbornGDABP94>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/et/et5.html#SandbornGDABP94>
rdfs:seeAlso <https://doi.org/10.1007/BF00972080>
dc:subject Conceptual design; flip chip bonding; multichip module (MCM); packaging and interconnect; trade-off analysis (xsd:string)
dc:title Multichip systems trade-off analysis tool. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 5 (xsd:string)