A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/et/TanY01
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dcterms:
bibliographicCitation
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http://dblp.uni-trier.de/rec/bibtex/journals/et/TanY01
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dc:
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https://dblp.l3s.de/d2r/resource/authors/Kelvin_Ngan_Chong_Yeo
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DBLP journals/et/TanY01
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2001
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A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
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63-68
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dc:
subject
SWEAT; electromigration testing; accelerated stress testing; reliability statistics; wafer-level reliability
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dc:
title
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
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