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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/et/TanY01>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cher_Ming_Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kelvin_Ngan_Chong_Yeo>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1023%2FA%3A1011102127642>
foaf:homepage <https://doi.org/10.1023/A:1011102127642>
dc:identifier DBLP journals/et/TanY01 (xsd:string)
dc:identifier DOI doi.org%2F10.1023%2FA%3A1011102127642 (xsd:string)
dcterms:issued 2001 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/et>
rdfs:label A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cher_Ming_Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kelvin_Ngan_Chong_Yeo>
swrc:number 1 (xsd:string)
swrc:pages 63-68 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/et/TanY01/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/et/TanY01>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/et/et17.html#TanY01>
rdfs:seeAlso <https://doi.org/10.1023/A:1011102127642>
dc:subject SWEAT; electromigration testing; accelerated stress testing; reliability statistics; wafer-level reliability (xsd:string)
dc:title A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 17 (xsd:string)