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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieiceee/DaiZYWC22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Wei_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fengwei_Dai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guojun_Wang_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liqiang_Cao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yangyang_Yan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Felex.18.20210453>
foaf:homepage <https://doi.org/10.1587/elex.18.20210453>
dc:identifier DBLP journals/ieiceee/DaiZYWC22 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Felex.18.20210453 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieiceee>
rdfs:label Research on Ni3Sn4 intermetallic compound for 5őľm diameter Cu/Ni/Sn-3.0Ag micro bumps. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_Wei_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fengwei_Dai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guojun_Wang_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liqiang_Cao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yangyang_Yan>
swrc:number 2 (xsd:string)
swrc:pages 20210453 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieiceee/DaiZYWC22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieiceee/DaiZYWC22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee19.html#DaiZYWC22>
rdfs:seeAlso <https://doi.org/10.1587/elex.18.20210453>
dc:title Research on Ni3Sn4 intermetallic compound for 5őľm diameter Cu/Ni/Sn-3.0Ag micro bumps. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 19 (xsd:string)