[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieiceee/KimB13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chang-Wook_Baek>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jun-Ku_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Felex.10.20130453>
foaf:homepage <https://doi.org/10.1587/elex.10.20130453>
dc:identifier DBLP journals/ieiceee/KimB13 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Felex.10.20130453 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieiceee>
rdfs:label Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chang-Wook_Baek>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jun-Ku_Kim>
swrc:number 15 (xsd:string)
swrc:pages 20130453 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieiceee/KimB13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieiceee/KimB13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee10.html#KimB13>
rdfs:seeAlso <https://doi.org/10.1587/elex.10.20130453>
dc:title Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 10 (xsd:string)