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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieiceee/OhbaKMMFK15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Koji_Fujimoto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nobuhide_Maeda>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shoichi_Kodama>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ohba>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yoriko_Mizushima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Suk_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Felex.12.20152002>
foaf:homepage <https://doi.org/10.1587/elex.12.20152002>
dc:identifier DBLP journals/ieiceee/OhbaKMMFK15 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Felex.12.20152002 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieiceee>
rdfs:label Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Koji_Fujimoto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nobuhide_Maeda>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shoichi_Kodama>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ohba>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yoriko_Mizushima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Suk_Kim>
swrc:number 7 (xsd:string)
swrc:pages 20152002 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieiceee/OhbaKMMFK15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieiceee/OhbaKMMFK15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee12.html#OhbaKMMFK15>
rdfs:seeAlso <https://doi.org/10.1587/elex.12.20152002>
dc:title Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 12 (xsd:string)