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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieiceee/YodaETH04>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hirokazu_Ezawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kaori_Tsutsumi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Makoto_Honda>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takashi_Yoda>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Felex.1.263>
foaf:homepage <https://doi.org/10.1587/elex.1.263>
dc:identifier DBLP journals/ieiceee/YodaETH04 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Felex.1.263 (xsd:string)
dcterms:issued 2004 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieiceee>
rdfs:label The sprint process of Al interconnects with low-temperature PVD via filling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hirokazu_Ezawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kaori_Tsutsumi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Makoto_Honda>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takashi_Yoda>
swrc:number 9 (xsd:string)
swrc:pages 263-268 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieiceee/YodaETH04/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieiceee/YodaETH04>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee1.html#YodaETH04>
rdfs:seeAlso <https://doi.org/10.1587/elex.1.263>
dc:title The sprint process of Al interconnects with low-temperature PVD via filling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 1 (xsd:string)