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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieicet/HigurashiOKSH17>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eiji_Higurashi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kei_Hagiwara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ken_Okumura>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tadatomo_Suga>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yutaka_Kunimune>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Ftransele.E100.C.156>
foaf:homepage <https://doi.org/10.1587/transele.E100.C.156>
dc:identifier DBLP journals/ieicet/HigurashiOKSH17 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Ftransele.E100.C.156 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieicet>
rdfs:label Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eiji_Higurashi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kei_Hagiwara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ken_Okumura>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tadatomo_Suga>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yutaka_Kunimune>
swrc:number 2 (xsd:string)
swrc:pages 156-160 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieicet/HigurashiOKSH17/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieicet/HigurashiOKSH17>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieicet/ieicet100c.html#HigurashiOKSH17>
rdfs:seeAlso <https://doi.org/10.1587/transele.E100.C.156>
dc:title Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 100-C (xsd:string)