High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

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dcterms:bibliographicCitation	<http://dblp.uni-trier.de/rec/bibtex/journals/ieicet/KanazawaYUKOOST19>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Atsushi_Araratake>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Hiromasa_Tanobe>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Yamazaki>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Johsuke_Ozaki>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Satoshi_Tsunashima>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Shigeru_Kanazawa>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Takahiko_Shindo>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Wataru_Kobayashi>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Yoshihiro_Ogiso>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Yuta_Ueda>
foaf:homepage	<http://dx.doi.org/doi.org%2F10.1587%2Ftransele.2018ODI0001>
foaf:homepage	<https://doi.org/10.1587/transele.2018ODI0001>
dc:identifier	DBLP journals/ieicet/KanazawaYUKOOST19 (xsd:string)
dc:identifier	DOI doi.org%2F10.1587%2Ftransele.2018ODI0001 (xsd:string)
dcterms:issued	2019 (xsd:gYear)
swrc:journal	<https://dblp.l3s.de/d2r/resource/journals/ieicet>
rdfs:label	High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. (xsd:string)
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Atsushi_Araratake>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Hiromasa_Tanobe>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Yamazaki>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Johsuke_Ozaki>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Satoshi_Tsunashima>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Shigeru_Kanazawa>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Takahiko_Shindo>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Wataru_Kobayashi>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Yoshihiro_Ogiso>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Yuta_Ueda>
swrc:number	4 (xsd:string)
swrc:pages	340-346 (xsd:string)
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rdfs:seeAlso	<http://dblp.uni-trier.de/db/journals/ieicet/ieicet102c.html#KanazawaYUKOOST19>
rdfs:seeAlso	<https://doi.org/10.1587/transele.2018ODI0001>
dc:title	High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. (xsd:string)
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swrc:volume	102-C (xsd:string)