Microwave Characterization of Copper-Clad Dielectric Laminate Substrates. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

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foaf:homepage	<http://dx.doi.org/doi.org%2F10.1093%2Fietele%2Fe90-c.12.2178>
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dc:title	Microwave Characterization of Copper-Clad Dielectric Laminate Substrates. (xsd:string)
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