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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieicet/OhYHKJHCKWL05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bin-Feng_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Han-Seob_Cha>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hee-Hwan_Ji>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hi-Deok_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jang-Gn_Yun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jin-Suk_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sang-Bum_Huh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Soon-Young_Oh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ui-Sik_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yong-Jin_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1093%2Fietele%2Fe88-c.4.651>
foaf:homepage <https://doi.org/10.1093/ietele/e88-c.4.651>
dc:identifier DBLP journals/ieicet/OhYHKJHCKWL05 (xsd:string)
dc:identifier DOI doi.org%2F10.1093%2Fietele%2Fe88-c.4.651 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieicet>
rdfs:label Thermally Robust Nickel Silicide Process for Nano-Scale CMOS Technology. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bin-Feng_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Han-Seob_Cha>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hee-Hwan_Ji>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hi-Deok_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jang-Gn_Yun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jin-Suk_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sang-Bum_Huh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Soon-Young_Oh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ui-Sik_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yong-Jin_Kim>
swrc:number 4 (xsd:string)
swrc:pages 651-655 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieicet/OhYHKJHCKWL05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieicet/OhYHKJHCKWL05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieicet/ieicet88c.html#OhYHKJHCKWL05>
rdfs:seeAlso <https://doi.org/10.1093/ietele/e88-c.4.651>
dc:title Thermally Robust Nickel Silicide Process for Nano-Scale CMOS Technology. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 88-C (xsd:string)