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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieicet/YoshidaTKSTT12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kazuo_Tsubouchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Noriharu_Suematsu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Satoshi_Yoshida>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shoichi_Tanifuji>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Suguru_Kameda>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tadashi_Takagi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Ftransele.E95.C.1276>
foaf:homepage <https://doi.org/10.1587/transele.E95.C.1276>
dc:identifier DBLP journals/ieicet/YoshidaTKSTT12 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Ftransele.E95.C.1276 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieicet>
rdfs:label 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kazuo_Tsubouchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Noriharu_Suematsu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Satoshi_Yoshida>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shoichi_Tanifuji>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Suguru_Kameda>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tadashi_Takagi>
swrc:number 7 (xsd:string)
swrc:pages 1276-1284 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieicet/YoshidaTKSTT12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieicet/YoshidaTKSTT12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieicet/ieicet95c.html#YoshidaTKSTT12>
rdfs:seeAlso <https://doi.org/10.1587/transele.E95.C.1276>
dc:title 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 95-C (xsd:string)