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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ieicetc/WadatsumiKHMHSFKMN23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiromu_Hasegawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kondo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kikuo_Muramatsu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kohei_Kawai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Makoto_Nagata>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rikuu_Hasegawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takahito_Fukushima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuji_Miki>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuya_Sawada>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuya_Wadatsumi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1587%2Ftransele.2022ctp0004>
foaf:homepage <https://doi.org/10.1587/transele.2022ctp0004>
dc:identifier DBLP journals/ieicetc/WadatsumiKHMHSFKMN23 (xsd:string)
dc:identifier DOI doi.org%2F10.1587%2Ftransele.2022ctp0004 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ieicetc>
rdfs:label Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiromu_Hasegawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kondo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kikuo_Muramatsu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kohei_Kawai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Makoto_Nagata>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rikuu_Hasegawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takahito_Fukushima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuji_Miki>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuya_Sawada>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuya_Wadatsumi>
swrc:month October (xsd:string)
swrc:number 10 (xsd:string)
swrc:pages 556-564 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ieicetc/WadatsumiKHMHSFKMN23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ieicetc/WadatsumiKHMHSFKMN23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ieicetc/ieicetc106.html#WadatsumiKHMHSFKMN23>
rdfs:seeAlso <https://doi.org/10.1587/transele.2022ctp0004>
dc:title Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 106 (xsd:string)