Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/iet-cds/MossaHE16
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Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit.
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Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit.
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