[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ijmtm/PingS09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Caijun_Shen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yang_Ping>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1504%2FIJMTM.2009.026393>
foaf:homepage <https://doi.org/10.1504/IJMTM.2009.026393>
dc:identifier DBLP journals/ijmtm/PingS09 (xsd:string)
dc:identifier DOI doi.org%2F10.1504%2FIJMTM.2009.026393 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ijmtm>
rdfs:label Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Caijun_Shen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yang_Ping>
swrc:number 3 (xsd:string)
swrc:pages 333-339 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ijmtm/PingS09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ijmtm/PingS09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ijmtm/ijmtm18.html#PingS09>
rdfs:seeAlso <https://doi.org/10.1504/IJMTM.2009.026393>
dc:title Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 18 (xsd:string)