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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/isafm/ChienLJ06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Angus_Jeang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chen-Fu_Chien_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Huan-Chung_Li>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1002%2Fisaf.273>
foaf:homepage <https://doi.org/10.1002/isaf.273>
dc:identifier DBLP journals/isafm/ChienLJ06 (xsd:string)
dc:identifier DOI doi.org%2F10.1002%2Fisaf.273 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/isafm>
rdfs:label Data mining for improving the solder bumping process in the semiconductor packaging industry. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Angus_Jeang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chen-Fu_Chien_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Huan-Chung_Li>
swrc:number 1-2 (xsd:string)
swrc:pages 43-57 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/isafm/ChienLJ06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/isafm/ChienLJ06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/isafm/isafm14.html#ChienLJ06>
rdfs:seeAlso <https://doi.org/10.1002/isaf.273>
dc:title Data mining for improving the solder bumping process in the semiconductor packaging industry. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 14 (xsd:string)