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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/jssc/ChenSASS24>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hidehiro_Shiga>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jae-Sun_Seo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Massimo_Alioto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mike_Shuo-Wei_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Visvesh_S._Sathe_0001>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FJSSC.2023.3328667>
foaf:homepage <https://doi.org/10.1109/JSSC.2023.3328667>
dc:identifier DBLP journals/jssc/ChenSASS24 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FJSSC.2023.3328667 (xsd:string)
dcterms:issued 2024 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/jssc>
rdfs:label Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hidehiro_Shiga>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jae-Sun_Seo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Massimo_Alioto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mike_Shuo-Wei_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Visvesh_S._Sathe_0001>
swrc:month January (xsd:string)
swrc:number 1 (xsd:string)
swrc:pages 4-7 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/jssc/ChenSASS24/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/jssc/ChenSASS24>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/jssc/jssc59.html#ChenSASS24>
rdfs:seeAlso <https://doi.org/10.1109/JSSC.2023.3328667>
dc:title Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 59 (xsd:string)