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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/jssc/KnickerbockerPA06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chirag_S._Patel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cornelia_K._Tsang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Edmund_J._Sprogis>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hua_Gan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/John_M._Cotte>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/John_U._Knickerbocker>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/L._Paivikki_Buchwalter>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Paul_S._Andry>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Raymond_R._Horton>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_J._Polastre>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Steven_L._Wright>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FJSSC.2006.877252>
foaf:homepage <https://doi.org/10.1109/JSSC.2006.877252>
dc:identifier DBLP journals/jssc/KnickerbockerPA06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FJSSC.2006.877252 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/jssc>
rdfs:label 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chirag_S._Patel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cornelia_K._Tsang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Edmund_J._Sprogis>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hua_Gan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/John_M._Cotte>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/John_U._Knickerbocker>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/L._Paivikki_Buchwalter>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Paul_S._Andry>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Raymond_R._Horton>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_J._Polastre>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Steven_L._Wright>
swrc:number 8 (xsd:string)
swrc:pages 1718-1725 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/jssc/KnickerbockerPA06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/jssc/KnickerbockerPA06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/jssc/jssc41.html#KnickerbockerPA06>
rdfs:seeAlso <https://doi.org/10.1109/JSSC.2006.877252>
dc:title 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 41 (xsd:string)