Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
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bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Abdelkarim_Mercha
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Alain_Phommahaxay
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ann_Opdebeeck
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Antonio_Pullini
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Bart_De_Wachter
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Bart_Vandevelde
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Cristina_Torregiani
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dan_Perry
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dimitri_Linten
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dimitrios_Velenis
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Federico_Angiolini
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Guruprasad_Katti
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Herman_Oprins
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Igor_Loi
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jan_Van_Olmen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Luca_Benini
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Marc_Nelis
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Michal_Rakowski
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Michele_Stucchi
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Miro_Cupac
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Morin_Dehan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Muriel_de_Potter_de_ten_Broeck
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nikolaos_Minas
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Paresh_Limaye
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Paul_Marchal
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Rahul_Agarwal
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Riet_Labie
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Stephane_Bronckers
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Steven_Thijs
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Veerle_Simons
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Vladimir_Cherman
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wim_Dehaene
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wouter_Ruythooren
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Youssef_Travaly
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FJSSC.2010.2074070
>
foaf:
homepage
<
https://doi.org/10.1109/JSSC.2010.2074070
>
dc:
identifier
DBLP journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FJSSC.2010.2074070
(xsd:string)
dcterms:
issued
2011
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/jssc
>
rdfs:
label
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Abdelkarim_Mercha
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Alain_Phommahaxay
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ann_Opdebeeck
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Antonio_Pullini
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Bart_De_Wachter
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Bart_Vandevelde
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Cristina_Torregiani
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dan_Perry
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dimitri_Linten
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dimitrios_Velenis
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Federico_Angiolini
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Guruprasad_Katti
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Herman_Oprins
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Igor_Loi
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jan_Van_Olmen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Luca_Benini
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Marc_Nelis
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Michal_Rakowski
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Michele_Stucchi
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Miro_Cupac
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Morin_Dehan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Muriel_de_Potter_de_ten_Broeck
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nikolaos_Minas
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Paresh_Limaye
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Paul_Marchal
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Rahul_Agarwal
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Riet_Labie
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Stephane_Bronckers
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Steven_Thijs
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Veerle_Simons
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Vladimir_Cherman
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wim_Dehaene
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wouter_Ruythooren
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Youssef_Travaly
>
swrc:
number
1
(xsd:string)
swrc:
pages
293-307
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/jssc/jssc46.html#PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11
>
rdfs:
seeAlso
<
https://doi.org/10.1109/JSSC.2010.2074070
>
dc:
title
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
46
(xsd:string)