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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/jssc/TokumitsuHYYNA97>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chikara_Yamaguchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kenjiro_Nishikawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kimiyoshi_Yamasaki>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Makoto_Hirano>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masayoshi_Aikawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tsuneo_Tokumitsu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F4.628736>
foaf:homepage <https://doi.org/10.1109/4.628736>
dc:identifier DBLP journals/jssc/TokumitsuHYYNA97 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F4.628736 (xsd:string)
dcterms:issued 1997 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/jssc>
rdfs:label Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chikara_Yamaguchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kenjiro_Nishikawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kimiyoshi_Yamasaki>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Makoto_Hirano>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masayoshi_Aikawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tsuneo_Tokumitsu>
swrc:number 9 (xsd:string)
swrc:pages 1334-1341 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/jssc/TokumitsuHYYNA97/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/jssc/TokumitsuHYYNA97>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/jssc/jssc32.html#TokumitsuHYYNA97>
rdfs:seeAlso <https://doi.org/10.1109/4.628736>
dc:title Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 32 (xsd:string)