Beyond Wires: The Future of Interconnects.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/micro/Lee24a
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Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/micro/Lee24a
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hsien-Hsin_S._Lee
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FMM.2024.3373336
>
foaf:
homepage
<
https://doi.org/10.1109/MM.2024.3373336
>
dc:
identifier
DBLP journals/micro/Lee24a
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FMM.2024.3373336
(xsd:string)
dcterms:
issued
2024
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/micro
>
rdfs:
label
Beyond Wires: The Future of Interconnects.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hsien-Hsin_S._Lee
>
swrc:
month
March - April
(xsd:string)
swrc:
number
2
(xsd:string)
swrc:
pages
4-5
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/micro/Lee24a/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/micro/Lee24a
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/micro/micro44.html#Lee24a
>
rdfs:
seeAlso
<
https://doi.org/10.1109/MM.2024.3373336
>
dc:
title
Beyond Wires: The Future of Interconnects.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
44
(xsd:string)