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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/micro/ShangPKJ06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Amit_Kumar_0002>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li-Shiuan_Peh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Niraj_K._Jha>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FMM.2006.23>
foaf:homepage <https://doi.org/10.1109/MM.2006.23>
dc:identifier DBLP journals/micro/ShangPKJ06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FMM.2006.23 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/micro>
rdfs:label Temperature-Aware On-Chip Networks. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Amit_Kumar_0002>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li-Shiuan_Peh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Niraj_K._Jha>
swrc:number 1 (xsd:string)
swrc:pages 130-139 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/micro/ShangPKJ06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/micro/ShangPKJ06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/micro/micro26.html#ShangPKJ06>
rdfs:seeAlso <https://doi.org/10.1109/MM.2006.23>
dc:subject Temperature-aware, on-chip networks, thermal, thermal modeling, simulation framework, thermal management (xsd:string)
dc:title Temperature-Aware On-Chip Networks. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 26 (xsd:string)