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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/micro/X02e>
foaf:homepage <http://doi.ieeecomputersociety.org/10.1109/MM.2002.10014>
foaf:homepage <http://dx.doi.org/10.1109%2FMM.2002.10014>
dc:identifier DBLP journals/micro/X02e (xsd:string)
dc:identifier DOI 10.1109%2FMM.2002.10014 (xsd:string)
dcterms:issued 2002 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/micro>
rdfs:label News: Intel expands advanced 300-mm wafer production; IBM claims world's smallest computer circuits; IEEE 802.11b chip market growth; Samsung extends system LSI commitment; light-emitting silicon; new gas sensors. (xsd:string)
swrc:number 6 (xsd:string)
swrc:pages 6 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/micro/X02e/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/micro/X02e>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/micro/micro22.html#X02e>
rdfs:seeAlso <http://doi.ieeecomputersociety.org/10.1109/MM.2002.10014>
dc:title News: Intel expands advanced 300-mm wafer production; IBM claims world's smallest computer circuits; IEEE 802.11b chip market growth; Samsung extends system LSI commitment; light-emitting silicon; new gas sensors. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 22 (xsd:string)