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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/micromachines/FukushimaHYKMBL16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hideto_Hashiguchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Yonekura>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kino>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ji_Chel_Bea>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kang_Wook_Lee_0002>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mariappan_Murugesan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mitsumasa_Koyanagi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takafumi_Fukushima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tetsu_Tanaka>
foaf:homepage <http://dx.doi.org/doi.org%2F10.3390%2Fmi7100184>
foaf:homepage <https://doi.org/10.3390/mi7100184>
dc:identifier DBLP journals/micromachines/FukushimaHYKMBL16 (xsd:string)
dc:identifier DOI doi.org%2F10.3390%2Fmi7100184 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/micromachines>
rdfs:label Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hideto_Hashiguchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Yonekura>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kino>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ji_Chel_Bea>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kang_Wook_Lee_0002>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mariappan_Murugesan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mitsumasa_Koyanagi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takafumi_Fukushima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tetsu_Tanaka>
swrc:number 10 (xsd:string)
swrc:pages 184 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/micromachines/FukushimaHYKMBL16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/micromachines/FukushimaHYKMBL16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/micromachines/micromachines7.html#FukushimaHYKMBL16>
rdfs:seeAlso <https://doi.org/10.3390/mi7100184>
dc:title Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 7 (xsd:string)