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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mj/GuanXXZLG23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jian_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kun_Xi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiaonan_Guan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yanlin_Ge>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhihui_Xie>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhuoqun_Lu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2023.105723>
foaf:homepage <https://doi.org/10.1016/j.mejo.2023.105723>
dc:identifier DBLP journals/mj/GuanXXZLG23 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.mejo.2023.105723 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mj>
rdfs:label Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jian_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kun_Xi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiaonan_Guan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yanlin_Ge>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhihui_Xie>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhuoqun_Lu>
swrc:month April (xsd:string)
swrc:pages 105723 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mj/GuanXXZLG23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mj/GuanXXZLG23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mj/mj134.html#GuanXXZLG23>
rdfs:seeAlso <https://doi.org/10.1016/j.mejo.2023.105723>
dc:title Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 134 (xsd:string)