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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mj/HouzetLBAASF21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bernard_Fl%E2%88%9A%C2%A9chet>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C%E2%88%9A%C2%A9dric_Bermond>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Auch%E2%88%9A%C2%AEre>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gregory_Houzet>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Laurent_Schwarz>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Philippe_Artillan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thierry_Lacrevaz>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2021.104990>
foaf:homepage <https://doi.org/10.1016/j.mejo.2021.104990>
dc:identifier DBLP journals/mj/HouzetLBAASF21 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.mejo.2021.104990 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mj>
rdfs:label In-situ characterization up to 100 ‚ÄčGHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bernard_Fl%E2%88%9A%C2%A9chet>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C%E2%88%9A%C2%A9dric_Bermond>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_Auch%E2%88%9A%C2%AEre>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gregory_Houzet>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Laurent_Schwarz>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Philippe_Artillan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thierry_Lacrevaz>
swrc:pages 104990 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mj/HouzetLBAASF21/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mj/HouzetLBAASF21>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mj/mj108.html#HouzetLBAASF21>
rdfs:seeAlso <https://doi.org/10.1016/j.mejo.2021.104990>
dc:title In-situ characterization up to 100 ‚ÄčGHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 108 (xsd:string)