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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mj/HuangLLBTY20a>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ning_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qinghua_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ting_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Bai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Weijing_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiadong_Tang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2020.104846>
foaf:homepage <https://doi.org/10.1016/j.mejo.2020.104846>
dc:identifier DBLP journals/mj/HuangLLBTY20a (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.mejo.2020.104846 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mj>
rdfs:label Thermal and electrical performance investigation of FinFET with encased air-gap gate sidewalls from spacer encapsulation layer material and structure parameter perspectives. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ning_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qinghua_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ting_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Bai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Weijing_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiadong_Tang>
swrc:pages 104846 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mj/HuangLLBTY20a/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mj/HuangLLBTY20a>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mj/mj103.html#HuangLLBTY20a>
rdfs:seeAlso <https://doi.org/10.1016/j.mejo.2020.104846>
dc:title Thermal and electrical performance investigation of FinFET with encased air-gap gate sidewalls from spacer encapsulation layer material and structure parameter perspectives. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 103 (xsd:string)