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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mj/NoonanMCLKTDS06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aapo_Lankinen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andreas_N._Danilewsky>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._Noonan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/L._Knuuttila>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Patrick_J._McNally>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rolf_Simon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Turkka_O._Tuomi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Weimin_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2006.06.008>
foaf:homepage <https://doi.org/10.1016/j.mejo.2006.06.008>
dc:identifier DBLP journals/mj/NoonanMCLKTDS06 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.mejo.2006.06.008 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mj>
rdfs:label The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aapo_Lankinen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andreas_N._Danilewsky>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._Noonan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/L._Knuuttila>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Patrick_J._McNally>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rolf_Simon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Turkka_O._Tuomi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Weimin_Chen>
swrc:number 11 (xsd:string)
swrc:pages 1372-1378 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mj/NoonanMCLKTDS06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mj/NoonanMCLKTDS06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mj/mj37.html#NoonanMCLKTDS06>
rdfs:seeAlso <https://doi.org/10.1016/j.mejo.2006.06.008>
dc:title The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 37 (xsd:string)