Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mj/TaoLMSWSZRZ24
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mj/TaoLMSWSZRZ24
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chao_Liang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wenqiang_Zhang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Xiaoguang_Zhao
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yanan_Tao
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yong_Ruan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yu_Wu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yunna_Sun
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zhiqiang_Song
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ziqi_Mei
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2024.106089
>
foaf:
homepage
<
https://doi.org/10.1016/j.mejo.2024.106089
>
dc:
identifier
DBLP journals/mj/TaoLMSWSZRZ24
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.mejo.2024.106089
(xsd:string)
dcterms:
issued
2024
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mj
>
rdfs:
label
Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chao_Liang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wenqiang_Zhang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Xiaoguang_Zhao
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yanan_Tao
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yong_Ruan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yu_Wu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yunna_Sun
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zhiqiang_Song
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ziqi_Mei
>
swrc:
month
February
(xsd:string)
swrc:
pages
106089
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mj/TaoLMSWSZRZ24/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mj/TaoLMSWSZRZ24
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mj/mj144.html#TaoLMSWSZRZ24
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.mejo.2024.106089
>
dc:
title
Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
144
(xsd:string)