[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mj/TsangLKSLWLTE04>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/A._Krishnamoorthy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._F._Tsang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._Y._Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/H._Y._Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/K._Y._Ee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/L._J._Tang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/L._Y._Wong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/W._H._Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._J._Su>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2004.06.019>
foaf:homepage <https://doi.org/10.1016/j.mejo.2004.06.019>
dc:identifier DBLP journals/mj/TsangLKSLWLTE04 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.mejo.2004.06.019 (xsd:string)
dcterms:issued 2004 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mj>
rdfs:label Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/A._Krishnamoorthy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._F._Tsang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._Y._Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/H._Y._Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/K._Y._Ee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/L._J._Tang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/L._Y._Wong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/W._H._Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._J._Su>
swrc:number 9 (xsd:string)
swrc:pages 693-700 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mj/TsangLKSLWLTE04/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mj/TsangLKSLWLTE04>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mj/mj35.html#TsangLKSLWLTE04>
rdfs:seeAlso <https://doi.org/10.1016/j.mejo.2004.06.019>
dc:title Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 35 (xsd:string)