Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
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bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mj/TsangLKSLWLTE04
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/A._Krishnamoorthy
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/C._F._Tsang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/C._Y._Li
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/H._Y._Li
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/K._Y._Ee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/L._J._Tang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/L._Y._Wong
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/W._H._Li
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Y._J._Su
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2004.06.019
>
foaf:
homepage
<
https://doi.org/10.1016/j.mejo.2004.06.019
>
dc:
identifier
DBLP journals/mj/TsangLKSLWLTE04
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.mejo.2004.06.019
(xsd:string)
dcterms:
issued
2004
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mj
>
rdfs:
label
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/A._Krishnamoorthy
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/C._F._Tsang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/C._Y._Li
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/H._Y._Li
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/K._Y._Ee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/L._J._Tang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/L._Y._Wong
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/W._H._Li
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Y._J._Su
>
swrc:
number
9
(xsd:string)
swrc:
pages
693-700
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mj/TsangLKSLWLTE04/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mj/TsangLKSLWLTE04
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mj/mj35.html#TsangLKSLWLTE04
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.mejo.2004.06.019
>
dc:
title
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
35
(xsd:string)