Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mj/XuSLWZW22
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Da-Wei_Wang_0003
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ji_Xu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jun_Liu_0027
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wen-Sheng_Zhao
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yi-Ding_Wei
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ying_Sun
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.mejo.2021.105332
>
foaf:
homepage
<
https://doi.org/10.1016/j.mejo.2021.105332
>
dc:
identifier
DBLP journals/mj/XuSLWZW22
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.mejo.2021.105332
(xsd:string)
dcterms:
issued
2022
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mj
>
rdfs:
label
Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Da-Wei_Wang_0003
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ji_Xu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jun_Liu_0027
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wen-Sheng_Zhao
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yi-Ding_Wei
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ying_Sun
>
swrc:
pages
105332
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mj/XuSLWZW22/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mj/XuSLWZW22
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mj/mj119.html#XuSLWZW22
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.mejo.2021.105332
>
dc:
title
Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
119
(xsd:string)