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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/ChenWC06a>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J._D._Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kuo-Ming_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kuo-Ning_Chiang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2006.01.005>
foaf:homepage <https://doi.org/10.1016/j.microrel.2006.01.005>
dc:identifier DBLP journals/mr/ChenWC06a (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2006.01.005 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._D._Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kuo-Ming_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kuo-Ning_Chiang>
swrc:number 12 (xsd:string)
swrc:pages 2104-2111 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/ChenWC06a/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/ChenWC06a>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr46.html#ChenWC06a>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2006.01.005>
dc:title Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 46 (xsd:string)