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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/ChinLYT08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/H._K._Yow>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/P._K._Lam>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Teck_Yong_Tou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._T._Chin>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2008.04.003>
foaf:homepage <https://doi.org/10.1016/j.microrel.2008.04.003>
dc:identifier DBLP journals/mr/ChinLYT08 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2008.04.003 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/H._K._Yow>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/P._K._Lam>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Teck_Yong_Tou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._T._Chin>
swrc:number 7 (xsd:string)
swrc:pages 1079-1086 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/ChinLYT08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/ChinLYT08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr48.html#ChinLYT08>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2008.04.003>
dc:title Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 48 (xsd:string)