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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/CornigliRGGBFVT18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Antonio_Gnudi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._Varghese>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Davide_Cornigli>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Davide_Fabiani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Elena_Gnani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Enis_Tuncer>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Giorgio_Baccarani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Luu_Nguyen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Krishnan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Susanna_Reggiani>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2018.07.030>
foaf:homepage <https://doi.org/10.1016/j.microrel.2018.07.030>
dc:identifier DBLP journals/mr/CornigliRGGBFVT18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2018.07.030 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Antonio_Gnudi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._Varghese>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Davide_Cornigli>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Davide_Fabiani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Elena_Gnani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Enis_Tuncer>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Giorgio_Baccarani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Luu_Nguyen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Krishnan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Susanna_Reggiani>
swrc:pages 752-755 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/CornigliRGGBFVT18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/CornigliRGGBFVT18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr88.html#CornigliRGGBFVT18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2018.07.030>
dc:title Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 88-90 (xsd:string)