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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/DingTWHYZMT15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chunjin_Hang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fang_Yu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ling_Zhou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ruyu_Tian>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiangang_Meng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiuli_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yanhong_Tian>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ying_Ding>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2015.06.118>
foaf:homepage <https://doi.org/10.1016/j.microrel.2015.06.118>
dc:identifier DBLP journals/mr/DingTWHYZMT15 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2015.06.118 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chunjin_Hang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fang_Yu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ling_Zhou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ruyu_Tian>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiangang_Meng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiuli_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yanhong_Tian>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ying_Ding>
swrc:number 11 (xsd:string)
swrc:pages 2396-2402 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/DingTWHYZMT15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/DingTWHYZMT15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr55.html#DingTWHYZMT15>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2015.06.118>
dc:title Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 55 (xsd:string)