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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/FanWHWL16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li_Wei>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mengying_Fan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Wei>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiangning_Lu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhenzhi_He>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.08.010>
foaf:homepage <https://doi.org/10.1016/j.microrel.2016.08.010>
dc:identifier DBLP journals/mr/FanWHWL16 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2016.08.010 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li_Wei>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mengying_Fan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Wei>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiangning_Lu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhenzhi_He>
swrc:pages 192-197 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/FanWHWL16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/FanWHWL16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr65.html#FanWHWL16>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2016.08.010>
dc:title Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 65 (xsd:string)