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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/FioriGJT13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cl%E2%88%9A%C2%A9ment_Tavernier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Herv%E2%88%9A%C2%A9_Jaouen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9bastien_Gallois-Garreignot>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vincent_Fiori>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2012.08.015>
foaf:homepage <https://doi.org/10.1016/j.microrel.2012.08.015>
dc:identifier DBLP journals/mr/FioriGJT13 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2012.08.015 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cl%E2%88%9A%C2%A9ment_Tavernier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Herv%E2%88%9A%C2%A9_Jaouen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9bastien_Gallois-Garreignot>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vincent_Fiori>
swrc:number 2 (xsd:string)
swrc:pages 229-235 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/FioriGJT13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/FioriGJT13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr53.html#FioriGJT13>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2012.08.015>
dc:title Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 53 (xsd:string)