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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/FuggerPSHHDN14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Carsten_Sch%E2%88%9A%C2%A7ffer>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Herbert_Danninger>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Herbert_Hutter>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mathias_Nowottnick>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mathias_Plappert>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_Fugger>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Oliver_Humbel>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2014.04.016>
foaf:homepage <https://doi.org/10.1016/j.microrel.2014.04.016>
dc:identifier DBLP journals/mr/FuggerPSHHDN14 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2014.04.016 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Carsten_Sch%E2%88%9A%C2%A7ffer>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Herbert_Danninger>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Herbert_Hutter>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mathias_Nowottnick>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mathias_Plappert>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_Fugger>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Oliver_Humbel>
swrc:number 11 (xsd:string)
swrc:pages 2487-2493 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/FuggerPSHHDN14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/FuggerPSHHDN14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr54.html#FuggerPSHHDN14>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2014.04.016>
dc:title Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 54 (xsd:string)