Property | Value |
dcterms:bibliographicCitation
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<http://dblp.uni-trier.de/rec/bibtex/journals/mr/GanFCH14>
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dc:creator
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<https://dblp.l3s.de/d2r/resource/authors/Bak_Lee_Chan>
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dc:creator
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<https://dblp.l3s.de/d2r/resource/authors/Chong_Leong_Gan>
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dc:creator
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<https://dblp.l3s.de/d2r/resource/authors/Classe_Francis>
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dc:creator
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<https://dblp.l3s.de/d2r/resource/authors/Uda_Hashim>
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foaf:homepage
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<http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2013.10.024>
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foaf:homepage
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<https://doi.org/10.1016/j.microrel.2013.10.024>
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dc:identifier
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DBLP journals/mr/GanFCH14
(xsd:string)
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dc:identifier
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DOI doi.org%2F10.1016%2Fj.microrel.2013.10.024
(xsd:string)
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dcterms:issued
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2014
(xsd:gYear)
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swrc:journal
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<https://dblp.l3s.de/d2r/resource/journals/mr>
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rdfs:label
|
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online).
(xsd:string)
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foaf:maker
|
<https://dblp.l3s.de/d2r/resource/authors/Bak_Lee_Chan>
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foaf:maker
|
<https://dblp.l3s.de/d2r/resource/authors/Chong_Leong_Gan>
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foaf:maker
|
<https://dblp.l3s.de/d2r/resource/authors/Classe_Francis>
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foaf:maker
|
<https://dblp.l3s.de/d2r/resource/authors/Uda_Hashim>
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swrc:number
|
2
(xsd:string)
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swrc:pages
|
490
(xsd:string)
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owl:sameAs
|
<http://bibsonomy.org/uri/bibtexkey/journals/mr/GanFCH14/dblp>
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owl:sameAs
|
<http://dblp.rkbexplorer.com/id/journals/mr/GanFCH14>
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rdfs:seeAlso
|
<http://dblp.uni-trier.de/db/journals/mr/mr54.html#GanFCH14>
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rdfs:seeAlso
|
<https://doi.org/10.1016/j.microrel.2013.10.024>
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dc:title
|
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online).
(xsd:string)
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dc:type
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<http://purl.org/dc/dcmitype/Text>
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rdf:type
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swrc:Article
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rdf:type
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foaf:Document
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swrc:volume
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54
(xsd:string)
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